An Innovative Circuit Board Solution With Flexible PCB
How Small Can Flexible PCBs Be?
Flexible PCBs can be incredibly small and ultra-thin. some of the key things are as follows:
- Minimum trace widths of 25μm (1 mil) and microvias as small as 50μm (2 mils).
- The thinnest FPCs can be as slim as 0.05mm (50μm), enabling ultra-compact and lightweight designs.
- Maintain very tight profile tolerances.
- Impedance values can be maintained at +/-5% even in high volume applications.
- Use LPI solder mask on flexible substrates, keeping the solder mask intact.
- Add small stiffeners to give rigidity to one end of the material.
- Microcircuits require very fine lines and spaces, requiring specialized etching equipment.
These properties allow high-density electronic circuits in flexible and foldable formats, perfect for next-generation electronics such as foldable smartphones and implantable medical devices.
Flexible Circuit Boards
Flexible PCB Prototyping Process
Flexible PCB prototyping involves material selection (polyimide or PET), circuit patterning via etching or printing, and precise laser drilling. Copper traces are laminated, followed by via plating and solder mask application. Surface finishes like ENIG or OSP enhance durability. Rigorous electrical and bending tests ensure flexibility, reliability, and performance for dynamic applications.
Flexible PCB Applications in Various Industries
Flexible PCBs are essential in consumer electronics (smartphones, wearables) for compact, durable circuits. In medical devices (implantables, biosensors), they offer biocompatibility and precision. Automotive applications (ADAS, EV battery management) benefit from vibration resistance and thermal stability. In industrial automation (robotics, IoT sensors), they enhance connectivity, durability, and efficiency, ensuring reliable performance in demanding environments.
SCSPCBA’s Flexible PCB Manufacturing Capabilities
| SCSPCBA’s flex PCB Capabilities | Flexible Circuit Board Specifications | ||
|---|---|---|---|
| Flexible PCB types | single/double-sided flex PCB, multilayer flex PCB, transparent PCB, rigid-flex PCB | Flexible PCB materials | PI, PET, RA copper, ED copper, adhesive, stiffners (FR4, PI, stainless steel) |
| Flexibe PCB layer quantity | PI FPC: 1 to 10 PET clear FPC: 1 to 6 | Flexible PCB thickness | 0.05mm to 0.35mm (regular thickness is 0.2mm) |
| Thermo-bond Adhesives | Acrylic, Phenolic Butyral, Modified I Epoxy | Min. trace width/space | 0.0015″/.002(0.33oz.) 0.002″/.0025(0.5oz.) 0.003″/.0035(1oz.) |
| Minimum Via Hole Diameter (before plating ) | 0.006″ (NC Drill) 0.002″ (UV Laser) | Copper thickness | 0.25 oz.(9 um), 0.33 oz.(12 um), 0.5 oz.(17 um), 1 oz.(35 um), 2 oz.(70 um) |
| Minimum Blind Via Diameter (before plating) | 0.004″ (UV Laser) | Min. drill bit size | 6mil |
| Trace to Edge Distance | 0.O10″ ( NC Route ) 0.008″ (Die Punch) 0.001″ (UV Laser) | Coverlay | Line to PAD registration, 6mil ±2mil |
| Trace to Edge Tolerance | 0.O05″ ( NC Route ) 0.003″ (Die Punch) O.OO1″ (UV Laser) | Copper Foils (rolled-annealed) | Polyimide,Polyester, LPI (liquid photo imageable), PIC(photo imageable cover coat) |
| Cover Layer Aperture Positional Tolerance | O.O05″ (Cover Film) 0.O02″ (LPI and PIC) O.OO1″ (Laser Ablation) | Profile tolerance | (punching) ±3mil (laser cutting) ±2mil |
| Surface Finishes | Solder (hot air leveling or tin/lead plating), Electrolytic Soft BondableGold, Hard Gold, ENIG (electrolessnickel immersion gold), Entek 106A,& Immersion Tin | Hole size tolerance | (PTH) ±3mil (NPTH) ±2mil |
| Microvia aspect ratio | 3:1 | Impedance control | 50Ω ±5Ω, 90Ω ±9Ω, 100Ω ±10Ω |
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