High-TG PCBs

High-Tg PCB Manufacturing Process

High-TG PCB manufacturing involves specialized materials and precise processing to ensure thermal stability and durability. The key steps include:

Material Selection – Using high-TG laminates (TG ≥ 170°C) with low thermal expansion properties.

Multilayer Lamination – Controlled heat and pressure ensure strong layer bonding and minimal warping.

Drilling & Plating – High-precision drilling followed by copper plating enhances conductivity and reliability.

High-Temperature Curing – Ensures structural integrity and heat resistance.

Surface Treatment – Enhances oxidation resistance and solderability.

Quality Control – Rigorous thermal, mechanical, and electrical testing guarantees performance in demanding environments.

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High TG PCB

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Manufacturing Features of High-Tg PCB

High-TG PCB manufacturing involves selecting high-TG laminates (TG ≥ 170°C), multilayer lamination with controlled CTE, precise drilling, and high-temperature curing. Advanced surface treatments enhance durability, while stringent quality control ensures heat resistance, mechanical stability, and reliability for high-power and high-speed applications.

Application Fields of High-Tg PCB

Automotive Electronics: Engine control units (ECUs), LED headlights & power modules, Battery management systems (BMS)
Industrial & Power Electronics: Power converters & inverters, High-current switching power supplies, Robotics and automation
Aerospace & Defense: Avionics control boards, High-temperature-resistant communication systems
Consumer & Computing Electronics: High-performance GPUs & CPUs, 5G base stations and communication devices

SCSPCBA’s High-Tg PCB Manufacturing Capabilities

PCB Board Fabrication Capabilities
High Tg PCB Item		High Tg PCB Capability
Number of Layers	2 – 30 layers	Max Board Size	610mm × 1200mm
Min Board Thickness	0.6mm	Max Board Thickness	6.0mm
Base Materials	High-TG FR4, Polyimide, Ceramic, Metal Core	TG Rating	170°C, 180°C, 200°C+
Copper Thickness	1oz to 6oz (higher available upon request)	Min Line Width/Spacing	0.1mm/0.1mm (4mil/4mil)
Min Drilled Hole Size	0.2mm (laser drilling), 0.3mm (mechanical drilling)	Thermal Conductivity	0.3-2.0W/mK (FR4), 100-400W/mK (Metal Core)
CTE (Coefficient of Thermal Expansion)	11-16 ppm/°C	Surface Finishes	ENIG, HASL, Immersion Silver, OSP
Solder Mask Colors	Green, Blue, Black, White, Red	Testing Methods	Thermal shock test, Impedance test, X-ray inspection
Plated Holes Tolerance	0.08mm(min±0.05)	Non-plated Hole Tolerance	0.05min(min+0/-0.05mm or +0.05/-0mm)