Ceramic PCB

Ceramic PCB Manufacturing Process

Material Preparation – Using ceramic substrates like aluminum oxide (Al₂O₃) or aluminum nitride (AlN) for superior heat dissipation.

Circuit Formation – Applying thick-film or thin-film technology to create conductive traces.

High-Temperature Sintering – Firing the substrate at elevated temperatures to bond the conductive layer.

Drilling & Metallization – Laser or mechanical drilling, followed by metallization for via connections.

Surface Treatment – Applying ENIG, ENEPIG, or silver plating for enhanced conductivity and durability.

Testing & Inspection – Ensuring electrical performance, mechanical strength, and heat resistance.

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Ceramic PCB

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Manufacturing Features of Ceramic PCB

Ceramic PCBs are manufactured using high-temperature sintering, ensuring superior thermal conductivity (20W/mK–180W/mK) and excellent heat resistance (up to 850°C). They feature minimal CTE, matching semiconductor materials for enhanced reliability. Direct Metal Bonding (DMB) allows high-power copper circuit integration, improving performance in high-power applications. Their high mechanical strength and resistance to oxidation, corrosion, and moisture make them highly durable. However, due to their rigidity and brittle nature, careful handling is required. SCSPCBA specializes in high-quality ceramic PCB manufacturing, providing customized solutions for advanced electronic applications.

Application Fields of Ceramic PCB

Ceramic PCBs are widely used in high-power, high-frequency, and harsh-environment applications, including:

Power Electronics & LED Lighting: High-power LED modules, Automotive LED headlights, Power inverters and converters
Aerospace & Defense: Radar and satellite communication systems, Avionics and high-temperature sensors, Military-grade power electronics
Automotive Electronics: Electric vehicle (EV) battery management systems (BMS), Power control units and motor drivers, Advanced driver-assistance systems (ADAS)
Medical Equipment: Implantable medical devices (e.g., pacemakers), High-frequency RF medical imaging (MRI, CT scans), Blood pressure and glucose monitoring sensors
Telecommunications & RF Applications: 5G antennas and RF power amplifiers, Microwave circuits and waveguides, IoT and wireless communication devices
Industrial & Semiconductor Manufacturing: High-temperature sensors and power electronics, Semiconductor test and burn-in boards, High-frequency microelectronic packaging

SCSPCBA’s Ceramic PCB Manufacturing Capabilities

PCB Board Fabrication Capabilities
Ceramic PCB Item		Ceramic PCB Capability
PCB Layer Quantity	1, 2 (single-sided and double-sided)	Laser drilling	≥75μm
Ceramic PCB Substrate	AlN (aluminum nitride), Al₂O₃ (alumina), SiC, BeO, Si₃N₄ (silicon nitride), and Rogers ceramic materials	Copper Foil Peel Strength	more than 2N/mm (IPC-TM-650 2.4.8)
Ceramic PCB Manufacturing	DPC, DBC, HTCC, LTCC, thick-film, thin-film, and AMB	Solderability	>95% (IPC-TM-650 2.4.14)
Maximum PCB Size	138mm * 190mm	Thermal Resistance	350±10℃, 15min, no peeling, no popcorn (IPC-TM-650 2.4.7)
Ceramic PCB Thickness	0.25mm, 0.38mm, 0.5mm, 0.76mm, 0.8mm, 1mm, 1.5mm, 2mm	Surface Finish	OSP, immersion silver, immersion gold, nickel palladium gold
Size Tolerance	≤±50μm	Laser Cut	Laser engraving depth ≤ 0.7mm Laser-cut PCB thickness ≤ 3.0mm
Trace Width/Space	5-10μm: 0.05mm/0.05mm HOZ: 0.075mm/0.075mm 1OZ: 0.1mm/0.1mm 2OZ: 0.127mm/0.127mm 3OZ: 0.3mm/0.3mm 6OZ: 0.5mm/0.5mm 9OZ: 0.6mm/0.6mm	Hole Diameter Tolerance	PTH:±0.075mm, NPTH:±0.05mm
Copper Thickness	2μm to 105μm (DPC), 150μm to 300μm (DBC)	Minimum Laser Drill Diameter	75μm