Material Selection – Choosing high-quality laminates that can handle multiple layers and provide thermal stability.
Layer Stacking – Precision alignment of copper foils, prepreg, and core materials to form each layer.
Lamination – Applying high temperature and pressure to bond the layers into a solid structure.
Drilling & Plating – Micro-drilling for vias and plating to establish electrical connections between layers.
Etching & Imaging – Advanced etching techniques create precise circuit patterns on each layer.
Testing & Inspection – Rigorous electrical, mechanical, and thermal testing ensures reliability for complex, high-performance applications.
Ultra-high-layer PCBs, typically exceeding 30 layers, require advanced manufacturing techniques like sequential lamination, laser drilling, and precise impedance control. They offer high-density interconnects, excellent signal integrity, and superior reliability for complex applications. SCSPCBA specializes in producing ultra-high-layer PCBs with optimized stack-up designs, ensuring durability, electrical performance, and thermal management for aerospace, telecommunications, and high-performance computing industries.
Ultra-high-layer PCBs are widely used in cutting-edge industries requiring high performance, signal integrity, and thermal management, including:
Telecommunications & Networking: 5G base stations and high-speed data centers, High-frequency RF communication systems, Optical fiber transmission equipment
Aerospace & Defense: Avionics and military radar systems, Spacecraft communication modules, Missile guidance and satellite systems
Medical Equipment: MRI and CT scan imaging systems: Advanced diagnostic and monitoring devices
Automotive & Electric Vehicles: Advanced driver-assistance systems (ADAS), LiDAR and radar sensors for autonomous driving, Electric vehicle (EV) power distribution modules
Industrial & AI Computing: High-performance computing (HPC) systems, AI servers and quantum computing processors, Embedded computing and robotics
| Ultra-High-Layer PCB Item | Ultra-High-Layer PCB Capability | ||
|---|---|---|---|
| Number of Layers | 16 – 50+ layers | Surface Finishes | ENIG, Immersion Silver, Immersion Tin, OSP, HASL, Lead-free HASL |
| Max Board Size | 610mm × 1200mm (custom sizes available) | Solder Mask Colors | Green, Blue, Black, White, Red, Yellow |
| Min Board Thickness | 1.0mm | Impedance Control | Yes, with advanced simulation and strict tolerance (±5%) |
| Max Board Thickness | 12.0mm | Thermal Management | Thermal vias, heat sinks, metal core options available |
| Base Materials | FR4 (High-Tg), Rogers, PTFE, Polyimide, Ceramic | Warping Tolerance | ≤0.5% |
| Copper Thickness | 0.5oz (18µm) to 6oz (210µm) | Hole Copper Thickness | ≥25µm |
| Min Line Width/Spacing | 0.075mm/0.075mm (3mil/3mil) | Testing Methods | Flying probe, X-ray inspection, AOI, impedance test, high-voltage test, thermal cycling |
| Min Drilled Hole Diameter | 0.2mm (8mil) for mechanical drilling, 0.075mm (3mil) for laser drilling | Size Tolerance | ≤±50μm |
Tel: +86 (0)755-2561-8511
Email: sales@scspcba.com
US Add: 1363 Lincoln Ave, Suite 1, Holbrook, NY
China Add: Building 4, No. 33, AnSheng Road, Shajing Town, BaoAn district, Shenzhen, China.
Wuhan Add: Room 602, Ward Center, No.780 Gaoxin Avenue, East Lake High-tech Development Zone, Wuhan, China
