Thick Copper PCB

Characteristics of Thick Copper PCB

Thick Copper PCBs are designed for high-power and high-current applications, featuring copper layers ranging from 3oz to 200oz. Their key characteristics include:

High Current-Carrying Capacity – Supports large current flow with minimal resistance and heat buildup.
Superior Heat Dissipation – Effectively manages high temperatures, reducing thermal stress on components.
Enhanced Mechanical Strength – Reinforced board structure improves durability and reliability.
Improved Reliability – It withstands thermal cycling and mechanical stress, ensuring long-term performance.
Versatility – Suitable for power electronics, automotive, renewable energy, and industrial applications.

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Thick Copper PCB Manufacturing Process

Thick Copper PCBs feature enhanced current-carrying capacity, superior heat dissipation, and increased mechanical strength, making them ideal for power electronics and high-current applications. These PCBs, typically with copper thickness ranging from 2 oz to 10 oz or more, ensure reliable performance in demanding environments. Advanced manufacturing techniques, such as high-temperature lamination and precision etching, are employed to maintain accuracy and durability. SCSPCBA specializes in high-quality Thick Copper PCB production, offering customized solutions to optimize power distribution and thermal management for various industries.

Application Fields of Thick Copper PCB

Power Electronics & Industrial Equipment: Power distribution systems, High-power rectifiers and converters, Industrial motor controllers
Automotive & Electric Vehicles (EVs): Battery management systems (BMS), High-power LED drivers, Electric power steering (EPS)
Renewable Energy & Power Grids: Solar power inverters, Wind turbine power controllers, Smart grid power monitoring
Military & Aerospace: Radar and defense communication systems, High-power avionics and navigation controls, Harsh-environment applications
Medical Equipment: High-power medical imaging devices (MRI, CT scanners), Electrosurgical instruments

SCSPCBA’s Thick Copper PCB Manufacturing Capabilities

PCB Board Fabrication Capabilities
Thick Copper PCB Item		Thick Copper PCB Capability
Thick Copper PCB Layer Quantity	1 to 10	Min Board Thickness	0.8mm
PCB Copper Thickness	3oz to 14oz	Max Board Thickness	10mm (depends on copper thickness)
Dielectric Constant	4.2-4.7 (FR4), 6-10 (Polyimide)	Base Materials	FR4 (Standard & High-TG), Polyimide, Aluminum Core, Copper Core
Thick-copper PCB Thickness	0.5mm to 8mm	Min Line Width/Spacing	0.3mm/0.3mm (12mil/12mil), depends on copper thickness
Solder Mask Technology	Electrostatic spray solder mask	Min Drilled Hole Diameter	0.3mm (mechanical drilling), 0.2mm (laser drilling)
Circuit Etching Tolerance	±5%	Via Types	Plated Through-Hole (PTH), Thermal Vias, Buried & Blind Vias
Solder Mask Color	Green, black, blue, white, red, mink, yellow	Thermal Conductivity	2-5W/mK (FR4), 100-400W/mK (Metal Core)
Surface Finish	HASL: SMD 40µ to 2000µ”, GND 30µ to 800µ” ENIG: Au 1µ to 5µ”, Ni 80µ to 200µ” Immersion tin: 0.8µm to 1.2µm Immersion silver: 0.15µm to 0.45µm Hard gold plating: Au 1µ to 50µ”, Ni 80µ to 200µ” Peelable mask: 5mil Carbon ink: 0.3mil	Min. Trace Width/Space	3oz – 6.5mil/6.5mil 4oz – 8mil/8mil 5oz – 9.5mil/9.5mil 6oz – 11mil/11mil 7oz – 12.5mil/12.5mil 8oz – 14mil/14mil 9oz – 15.5mil/15.5mil 10oz – 17mil/17mil 11oz – 18.5mil/18.5mil 12oz – 21mil/21mil 13oz – 22.5mil/22.5mil 14oz – 24mil/24mil