Material Selection – Choosing flexible substrates like polyimide, which offer high thermal stability and mechanical flexibility.
Copper Lamination – Bonding copper foil to the flexible substrate, followed by applying an insulating dielectric layer.
Etching & Imaging – Using photolithography to transfer circuit patterns onto the copper layer, followed by etching to remove excess copper.
Drilling – Creating holes for vias and component leads using high-precision drilling techniques.
Surface Treatment – Applying surface finishes like ENIG or OSP to improve solderability and prevent oxidation.
Testing & Inspection – Conducting electrical, mechanical, and flexibility tests to ensure performance and durability.
Flexible circuit board are made from bendable substrates like polyimide, offering high flexibility, lightweight design, and excellent thermal performance. The manufacturing process involves copper lamination, etching, and drilling on flexible materials. These PCBs are ideal for compact, space-constrained applications like wearable devices, medical equipment, and flexible displays, providing reliability and durability in dynamic environments.
Flexible PCBs are essential in consumer electronics (smartphones, wearables) for compact, durable circuits. In medical devices (implantables, biosensors), they offer biocompatibility and precision. Automotive applications (ADAS, EV battery management) benefit from vibration resistance and thermal stability. In industrial automation (robotics, IoT sensors), they enhance connectivity, durability, and efficiency, ensuring reliable performance in demanding environments.
| SCSPCBA’s flex PCB Capabilities | Flexible Circuit Board Specifications | ||
|---|---|---|---|
| Flexible PCB types | single/double-sided flex PCB, multilayer flex PCB, transparent PCB, rigid-flex PCB | Flexible PCB materials | PI, PET, RA copper, ED copper, adhesive, stiffners (FR4, PI, stainless steel) |
| Flexibe PCB layer quantity | PI FPC: 1 to 10 PET clear FPC: 1 to 6 | Flexible PCB thickness | 0.05mm to 0.35mm (regular thickness is 0.2mm) |
| Thermo-bond Adhesives | Acrylic, Phenolic Butyral, Modified I Epoxy | Min. trace width/space | 0.0015″/.002(0.33oz.) 0.002″/.0025(0.5oz.) 0.003″/.0035(1oz.) |
| Minimum Via Hole Diameter (before plating ) | 0.006″ (NC Drill) 0.002″ (UV Laser) | Copper thickness | 0.25 oz.(9 um), 0.33 oz.(12 um), 0.5 oz.(17 um), 1 oz.(35 um), 2 oz.(70 um) |
| Minimum Blind Via Diameter (before plating) | 0.004″ (UV Laser) | Min. drill bit size | 6mil |
| Trace to Edge Distance | 0.O10″ ( NC Route ) 0.008″ (Die Punch) 0.001″ (UV Laser) | Coverlay | Line to PAD registration, 6mil ±2mil |
| Trace to Edge Tolerance | 0.O05″ ( NC Route ) 0.003″ (Die Punch) O.OO1″ (UV Laser) | Copper Foils (rolled-annealed) | Polyimide,Polyester, LPI (liquid photo imageable), PIC(photo imageable cover coat) |
| Cover Layer Aperture Positional Tolerance | O.O05″ (Cover Film) 0.O02″ (LPI and PIC) O.OO1″ (Laser Ablation) | Profile tolerance | (punching) ±3mil (laser cutting) ±2mil |
| Surface Finishes | Solder (hot air leveling or tin/lead plating), Electrolytic Soft BondableGold, Hard Gold, ENIG (electrolessnickel immersion gold), Entek 106A,& Immersion Tin | Hole size tolerance | (PTH) ±3mil (NPTH) ±2mil |
| Microvia aspect ratio | 3:1 | Impedance control | 50Ω ±5Ω, 90Ω ±9Ω, 100Ω ±10Ω |
Tel: +86 (0)755-2561-8511
Email: sales@scspcba.com
US Add: 1363 Lincoln Ave, Suite 1, Holbrook, NY
China Add: Building 4, No. 33, AnSheng Road, Shajing Town, BaoAn district, Shenzhen, China.
Wuhan Add: Room 602, Ward Center, No.780 Gaoxin Avenue, East Lake High-tech Development Zone, Wuhan, China
