Double Layer PCB

Double Layer PCB Manufacturing Process

Material Selection – Choosing a substrate material like FR4 serves as the base for the two copper layers.

Layer Lamination – Applying copper foil to both sides of the substrate and bonding it with heat and pressure.

Drilling & Plating – Drilling holes for vias and plating them with copper to create electrical connections between layers.

Etching & Imaging – Etching the copper to form circuit patterns on both sides, using photolithography for precision.

Surface Treatment – Applying surface finishes like HASL, ENIG, or OSP to improve solderability and corrosion resistance.

Testing & Inspection – Conducting electrical and mechanical testing to ensure functionality and quality.

PCB Fabrication Services

Double Layer PCB

characteristics of double-layer PCB

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Manufacturing Features of Double-Layer PCB

PCBs use FR4, high-frequency materials (e.g., Rogers), aluminum, ceramic, or polyimide for flexibility. Copper foil thickness ranges from 0.5oz to 2oz or more. Layer count varies from 4 to 32+, with high-end designs exceeding 50. Via types include THV, blind, buried, and microvias. Surface finishes like HASL, ENIG, and immersion silver optimize performance. A well-designed stack-up ensures signal integrity, thermal management, and mechanical strength.

Application Fields of Double-Layer PCB

Double-layer PCBs are widely used across different industries due to their enhanced capabilities and reasonable cost:

Industrial Control Systems: Used in automation, motor controllers, and power management systems.
Consumer Electronics: Found in gaming consoles, TVs, audio systems, and other home electronics.
Automotive Electronics: Used in infotainment systems, sensors, and engine control modules.
Medical Devices: Applied in diagnostic and monitoring equipment.
Telecommunications: Used in networking devices such as routers, switches, and signal amplifiers.
Power Supplies: Found in DC-DC converters, UPS systems, and high-efficiency power modules.

SCSPCBA’s Double-Layer PCB Manufacturing Capabilities

PCB Board Fabrication Capabilities
Double-Layer PCB Item		Double-Layer PCB Capability
Number of Layers	2 layers	Via Types	Plated Through-Hole (PTH)
Max Board Size	1200mm × 600mm (depending on factory capability)	Solder Mask Colors	Green, Blue, White, Black, Red, Yellow
Min Board Thickness	0.4mm	Final Tolerance	±0.1mm
Max Board Thickness	3.2mm	Warping	≤0.75%
Base Material	FR4, CEM-1, CEM-3, Paper-based (FR1, FR2), Aluminum-based	Hole Copper Thickness	≥20µm
Copper Foil Thickness	0.5oz (18µm), 1oz (35µm), 2oz (70µm), customizable	Testing Method	Flying probe test, test jig
Min Line Width/Spacing	0.1mm/0.1mm (4mil/4mil)	Surface Finish	OSP, HASL, Lead-free HASL, ENIG, Immersion Silver
Min Drilled Hole Diameter	0.2mm (8mil)	Plugging Visa Capability	0.2-0.8mm