Material Selection – Choosing aluminum substrates (e.g., aluminum base with dielectric layer) for effective heat conduction.
Layer Lamination – Bonding a copper layer to the aluminum base, using a dielectric layer for insulation.
Drilling & Plating – Drilling holes for vias and plating them with copper for electrical connections.
Etching & Imaging – Applying photolithography to create precise circuit patterns on the copper layer, followed by etching.
Surface Treatment – Applying surface finishes such as HASL, ENIG, or OSP for better solderability and corrosion resistance.
Testing & Inspection – Conducting thermal, electrical, and mechanical tests to ensure performance and durability.