An Innovative Circuit Board Solution With Flexible PCB
How Small Can Flexible PCBs Be?
Flexible PCBs can be incredibly small and ultra-thin. some of the key things are as follows:
- Minimum trace widths of 25μm (1 mil) and microvias as small as 50μm (2 mils).
- The thinnest FPCs can be as slim as 0.05mm (50μm), enabling ultra-compact and lightweight designs.
- Maintain very tight profile tolerances.
- Impedance values can be maintained at +/-5% even in high volume applications.
- Use LPI solder mask on flexible substrates, keeping the solder mask intact.
- Add small stiffeners to give rigidity to one end of the material.
- Microcircuits require very fine lines and spaces, requiring specialized etching equipment.
These properties allow high-density electronic circuits in flexible and foldable formats, perfect for next-generation electronics such as foldable smartphones and implantable medical devices.
Flexible Circuit Boards
Flexible PCB Prototyping Process
Flexible PCB prototyping involves design, material selection, photolithography, etching, drilling, plating, coverlay application, component assembly, and rigorous testing to ensure performance and reliability.
1. Design & Layout
Use CAD software to design circuit paths and define flex zones.
2. Material Selection
Choose the appropriate substrate, copper thickness, and coverlay based on application needs.
3. Photolithography & Etching
Pattern circuits onto flexible copper-clad laminates using etching techniques.
4. Drilling & Plating
Create microvias and plated-through holes (PTH) to establish electrical connections.
5. Coverlay & Insulation
Apply polyimide or polyester coverlay for protection and flexibility.
6. Component Assembly
Use SMT or wire bonding for assembling ICs and other components.
Flexible PCB Applications in Various Industries
Flexible PCBs are widely used in industries that require compact, durable, and lightweight electronic solutions:
1. Consumer Electronics
Flexible PCBs are widely used in Smartphones, foldable screens, cameras, and wearables (smartwatches, fitness bands) due to their thin, lightweight, and bendable design.
- Enables higher component density, faster signal transmission, and miniaturization
- Enable compact and durable electronic circuits
- Improving product reliability and reducing space constraints in high-tech gadgets.
2. Medical Devices
Flexible PCBs used in Implantable devices, hearing aids, MRI equipment, and biosensors.
- Their ability to conform to small, irregular spaces makes them ideal for advanced medical applications.
- Offer high durability, biocompatibility, and precision
3. Automotive Electronics
Used in ADAS, dashboard displays, EV battery management, and sensors, flexible PCBs withstand vibrations, high temperatures, and dynamic movements, ensuring high-performance and reliability in harsh automotive environments.
- Provides high-speed performance, EMI shielding, and thermal stability
4. Industrial Automation
In robotics, IoT sensors, and flexible touch panels, flexible PCBs provide high-density connectivity, durability, and space-saving solutions, enhancing the efficiency and longevity of industrial automation systems.
- Enhances reliability, durability, and data processing speed
SCSPCBA’s Flexible PCB Manufacturing Capabilities
| SCSPCBA’s flex PCB Capabilities | Flexible Circuit Board Specifications | ||
|---|---|---|---|
| Flexible PCB types | single/double-sided flex PCB, multilayer flex PCB, transparent PCB, rigid-flex PCB | Flexible PCB materials | PI, PET, RA copper, ED copper, adhesive, stiffners (FR4, PI, stainless steel) |
| Flexibe PCB layer quantity | PI FPC: 1 to 10 PET clear FPC: 1 to 6 | Flexible PCB thickness | 0.05mm to 0.35mm (regular thickness is 0.2mm) |
| Thermo-bond Adhesives | Acrylic, Phenolic Butyral, Modified I Epoxy | Min. trace width/space | 0.0015″/.002(0.33oz.) 0.002″/.0025(0.5oz.) 0.003″/.0035(1oz.) |
| Minimum Via Hole Diameter (before plating ) | 0.006″ (NC Drill) 0.002″ (UV Laser) | Copper thickness | 0.25 oz.(9 um), 0.33 oz.(12 um), 0.5 oz.(17 um), 1 oz.(35 um), 2 oz.(70 um) |
| Minimum Blind Via Diameter (before plating) | 0.004″ (UV Laser) | Min. drill bit size | 6mil |
| Trace to Edge Distance | 0.O10″ ( NC Route ) 0.008″ (Die Punch) 0.001″ (UV Laser) | Coverlay | Line to PAD registration, 6mil ±2mil |
| Trace to Edge Tolerance | 0.O05″ ( NC Route ) 0.003″ (Die Punch) O.OO1″ (UV Laser) | Copper Foils (rolled-annealed) | Polyimide,Polyester, LPI (liquid photo imageable), PIC(photo imageable cover coat) |
| Cover Layer Aperture Positional Tolerance | O.O05″ (Cover Film) 0.O02″ (LPI and PIC) O.OO1″ (Laser Ablation) | Profile tolerance | (punching) ±3mil (laser cutting) ±2mil |
| Surface Finishes | Solder (hot air leveling or tin/lead plating), Electrolytic Soft BondableGold, Hard Gold, ENIG (electrolessnickel immersion gold), Entek 106A,& Immersion Tin | Hole size tolerance | (PTH) ±3mil (NPTH) ±2mil |
| Microvia aspect ratio | 3:1 | Impedance control | 50Ω ±5Ω, 90Ω ±9Ω, 100Ω ±10Ω |
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