Simplify HDI Circuit Board Design to Reduce Production Costs
What Is HDI PCB
HDI (High-Density Interconnect) PCB is a type of printed circuit board that utilizes microvias, fine line width/spacing (≤ 50μm), and multi-layer interconnection technology to achieve higher circuit density and more compact designs. HDI PCBs are widely used in smartphones, wearable devices, high-end servers and other consumer electronics due to their miniaturization, high-speed signal transmission, and high reliability.
SCSPCBA has complete HDI PCB design, prototyping, and manufacturing capabilities to meet the high-density and high-precision requirements of high-end electronic products. Welcome to consult for more HDI PCB solutions!
HDI PCB
Material Requirements of HDI Circuit Board
There are three typical materials for HDI PCB: High Tg Substrates, Low-Loss Materials, High-Density Copper Foil, and Laser Drillable Laminates. The characteristics of HDI materials include:
| Material Type | Key Characteristics | Representative Materials |
|---|---|---|
| High Tg Substrates | High-temperature resistance, low Z-axis expansion | Isola FR408HR, Panasonic Megtron 6 |
| Low-Loss Materials | Suitable for high-speed signal transmission, reduced insertion loss | Rogers 4350B, Taconic TLY |
| High-Density Copper Foil | Supports fine line width (≤12μm) | Electrolytic copper foil, rolled copper foil |
| Laser Drillable Laminates | Suitable for microvia structures, improved reliability | RCC (Resin-Coated Copper), Non-Fiber Reinforced Substrates |
Applications of HDI PCB
HDI PCBs are essential in modern consumer electronics, enabling compact, high-performance designs.Small is the constant pursuit of electronics products. The mainboard size can be reduced when adopting HDI technology, which will leave much space for battery and other additional function components, and reduce the cost of overall products.
HDI PCB in Consumer Electronics: Smartphones, Wearable Devices, and High-End Servers
1. In smartphones, HDI technology allows for ultra-thin designs, high-speed signal transmission, and efficient heat dissipation, supporting 5G connectivity and advanced processing capabilities.
Advantages of high-frequency PCB in smartphones
- Enables ultra-thin and compact designs
- Supports high-speed signal transmission for 5G and AI processing
- Enhances thermal dissipation and reliability
2. Wearable devices, such as smartwatches and fitness trackers, benefit from miniaturized, lightweight, and power-efficient HDI PCBs, ensuring durability and extended battery life.
Advantages of high-frequency PCB in wearable devices
- Miniaturization for lightweight, ergonomic designs
- High durability to withstand daily use
- Optimized for low power consumption, extending battery life
3. High-end servers require multi-layer HDI PCBs with superior signal integrity and thermal management, supporting data-intensive applications, AI computing, and cloud services with high reliability and performance.
Advantages of high-frequency PCB in high-end servers
- Supports high-layer count and dense interconnects for advanced computing
- Reduces signal loss, improving data integrity and speed
- Enhances thermal management for stable, long-term operation
SCSPCBA’s HDI PCB Manufacturing Capabilities
| HDI PCB Board Fabrication Capabilities | HDI Circuit Board Specifications | ||
|---|---|---|---|
| HDI PCB including | Flexible PCB FR4 PCB Rigid-flex PCB | HDI PCB thickness | 0.15mm to 3.2mm |
| Flex PCB layer number | 4 to 64 | Min. trace width/space | Flex/rigid-flex PCBs: 1.6mil/1.6mil Rigid PCBs: 2.5mil/2.5mil |
| HDI PCB layer quantity | 2 to 30 | Min. laser drill diameter | 0.075mm |
| High-density layer quantity | Up to 20 layers | On the two sides of an HDI PCB | Electrical connections number 20/cm² or 130/in². the trace width and space are ≤ 100µm or 0.004”. |
| HDI PCB stackup | 1+N+1, 2+N+2, 3+N+3, 4+N+4 | Min. mechanical drill diameter | 0.15 mm |
| HDI PCB via | Blind via, Buried via, Staggered via, Stacked via, Skip via | HDI PCB board production capability | 3000m² per day |
| The internal layers without microvias | Standard lamination under high temperatures | Copper thickness | 100μm to 125μm |
| HDI Circuit Board Manufacturing | Build-up method | Solderability | >95% (IPC-TM-650 2.4.14) |
| Standard HDI Circuit Boards | One-time laminate | Surface finishes | HASL: SMD 40µ to 2000µ”, GND 30µ to 800µ” ENIG: Au 1µ to 5µ”, Ni 80µ to 200µ” Immersion tin: 0.8µm to 1.2µm Immersion silver: 0.15µm to 0.45µm Hard gold plating: Au 1µ to 50µ”, Ni 80µ to 200µ” Peelable mask: 5mil Carbon ink: 0.3mil |
| High-level HDI PCB boards | Two or more times of lamination technology |
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