Simplify Multi-layer Board Design to Reduce Production Costs
What Is HDI PCB
The HDI process is a high-density interconnection technology that manufactures high-performance and high-density printed circuit boards (PCBs). HDI technology achieves more compact and complex circuit layouts by increasing the number of layers, reducing the line widths and spacing, and adopting advanced manufacturing processes.
☑ Widely compatible design to adapt to a variety of high-end devices
☑ Enhance circuit board density to meet complex design requirements
☑ Blind and buried via technology to optimize signal transmission paths
☑ Improve heat dissipation efficiency and optimize circuit board performance
☑ High-reliability HDI technology to promote innovation in electronic equipment
HDI PCB/Blind and Buried Vias PCB
The Main Advantages of HDI Technology Include
- Multilayer circuit design: HDI technology utilizes multilayer circuit board design, which allows more circuit connections to be realized on a smaller area. By increasing the number of layers, the HDI PCB board production technology provides higher wiring density and more complex circuit structures.
- Smaller line widths and spacing: HDI technology uses smaller line widths and spacing, enabling more signal lines and power lines to be routed within limited space.
- Blind vias and buried vias: Blind and buried vias are widely used in the HDI process to reduce the length and delay of circuit paths and enhancing the speed and reliability of signal transmission.
- Microvia technology: HDI technology also includes microvia technology to achieve smaller vias size and higher connection density. Microvia technology commonly utilizes advanced techniques such as laser drilling or mechanical drilling to realize the manufacture of tiny holes.
- High-speed signal transmission: Since the HDI technology provides shorter circuit paths and lower signal delays, it is suitable for high-speed signal transmission applications, such as high-speed communications, computer networks, and embedded systems.
What Is Blind And Buried
Blind and buried vias are two types of vias commonly used in printed circuit board designs to provide interconnections between different layers of circuit on board.
Blind vias are vias that connect the outer layer to other inner layers, but they do not extend through the whole circuit board. They are commonly used when space is limited on the PCB outer layers, or when high-density electronics components require shorter connections.
On the other hand, buried vias are vias that connect inner layers without extending to the outer layers. Buried vias can improve design flexibility and enable more complex multilayer PCB circuit designs, as they free up space on the outer layers for routing traces or placing electronic parts.
Designing Blind and Buried Vias Circuit Board Consider Parameters
- Blind and buried vias’ location
- Blind and buried vias’ number and size
- The PCB layers in which blind vias and buried vias are located
- Blind and buried vias’ specifications
- PCB board layer stack-up
- PCB circuit board Material and process requirements
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