HDI PCB

HDI PCB Manufacturing Process

Material Selection – Choosing high-performance laminates that support fine traces and high-frequency signals.

Layer Stacking – Aligning multiple layers of copper and prepreg for increased interconnect density.

Microvia Drilling – Using laser technology to drill microvias for precise, small-hole connections between layers.

Lamination – Bonding layers together under heat and pressure to form a compact structure.

Etching & Imaging – Applying photolithography to create fine circuit patterns and etching excess copper.

Plating & Surface Treatment – Plating vias with copper and applying surface finishes like ENIG for solderability.

Testing & Inspection – Rigorous electrical and mechanical testing to ensure quality and reliability.

PCB Fabrication Services

HDI PCB

HDI PCB board design

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Manufacturing Features of HDI PCB

HDI circuit board feature high-density interconnects with finer traces and microvias, allowing for compact, high-performance designs. The manufacturing process includes multi-layer stacking, laser drilling of microvias, precise etching, and plating to ensure superior signal integrity and reliability. HDI PCBs are ideal for applications requiring miniaturization, such as smartphones, tablets, and wearable devices.

Applications of HDI PCB

HDI PCBs enable ultra-thin, high-speed, and efficient designs for smartphones, enhancing 5G and AI processing. In wearables, they provide miniaturization, durability, and low power consumption for extended battery life. High-end servers benefit from multi-layer HDI PCBs with superior signal integrity, dense interconnects, and thermal management, ensuring high reliability for AI computing and cloud services.

SCSPCBA’s HDI PCB Manufacturing Capabilities

PCB Board Fabrication Capabilities
HDI PCB Board Fabrication Capabilities		HDI Circuit Board Specifications
HDI PCB including	Flexible PCB FR4 PCB Rigid-flex PCB	HDI PCB thickness	0.15mm to 3.2mm
Flex PCB layer number	4 to 64	Min. trace width/space	Flex/rigid-flex PCBs: 1.6mil/1.6mil Rigid PCBs: 2.5mil/2.5mil
HDI PCB layer quantity	2 to 30	Min. laser drill diameter	0.075mm
High-density layer quantity	Up to 20 layers	On the two sides of an HDI PCB	Electrical connections number 20/cm² or 130/in². the trace width and space are ≤ 100µm or 0.004”.
HDI PCB stackup	1+N+1, 2+N+2, 3+N+3, 4+N+4	Min. mechanical drill diameter	0.15 mm
HDI PCB via	Blind via, Buried via, Staggered via, Stacked via, Skip via	HDI PCB board production capability	3000m² per day
The internal layers without microvias	Standard lamination under high temperatures	Copper thickness	100μm to 125μm
HDI Circuit Board Manufacturing	Build-up method	Solderability	>95% (IPC-TM-650 2.4.14)
Standard HDI Circuit Boards	One-time laminate	Surface finishes	HASL: SMD 40µ to 2000µ”, GND 30µ to 800µ” ENIG: Au 1µ to 5µ”, Ni 80µ to 200µ” Immersion tin: 0.8µm to 1.2µm Immersion silver: 0.15µm to 0.45µm Hard gold plating: Au 1µ to 50µ”, Ni 80µ to 200µ” Peelable mask: 5mil Carbon ink: 0.3mil
High-level HDI PCB boards	Two or more times of lamination technology