High-TG PCBs Are Essential for Reliable Performance in Extreme Conditions
Characteristics of High-TG PCB
High-TG PCBs are designed for high-temperature environments, offering enhanced thermal and mechanical stability. Key characteristics include:
- High Glass Transition Temperature (TG ≥ 170°C): Standard PCBs have a TG of around 130-140°C, while High-TG PCBs start from 170°C and go up to 200°C+.
- Excellent Heat Resistance: Suitable for applications with continuous high operating temperatures.
- Low Thermal Expansion (CTE Control): Reduces warping and mechanical stress in multilayer designs.
- Improved Chemical and Moisture Resistance: Enhances durability in harsh environments.
- Better Electrical Performance: Low dielectric loss and stable signal integrity.
- Supports High-Power & High-Speed Applications: Ideal for power electronics, automotive, and industrial use.
High TG PCB
Manufacturing Features of High-Tg PCB
1. Base Materials: High-TG FR4 (TG 170-180°C), Polyimide (TG 200°C+), Ceramic or Metal Core (for extreme heat resistance)
2. Copper Thickness: 1oz to 6oz (standard), higher thickness available
3. Layer Count: 2-30 layers (customizable for specific applications)
4. Thermal Management: Thermal vias and heat dissipation layers
5. Surface Finishes: HASL (Lead-Free), ENIG, Immersion Silver, OSP
6. Drilling & Etching Process: High-precision laser drilling for microvias, Special etching techniques to prevent material degradation
7. Testing & Quality Control: Thermal shock & cycling tests, High-frequency impedance tests
Application Fields of High-Tg PCB
- Automotive Electronics: Engine control units (ECUs), LED headlights & power modules, Battery management systems (BMS)
- Industrial & Power Electronics: Power converters & inverters, High-current switching power supplies, Robotics and automation
- Aerospace & Defense: Avionics control boards, High-temperature-resistant communication systems
- Consumer & Computing Electronics: High-performance GPUs & CPUs, 5G base stations and communication devices
SCSPCBA’s High-Tg PCB Manufacturing Capabilities
| High Tg PCB Item | High Tg PCB Capability | ||
|---|---|---|---|
| Number of Layers | 2 – 30 layers | Max Board Size | 610mm × 1200mm |
| Min Board Thickness | 0.6mm | Max Board Thickness | 6.0mm |
| Base Materials | High-TG FR4, Polyimide, Ceramic, Metal Core | TG Rating | 170°C, 180°C, 200°C+ |
| Copper Thickness | 1oz to 6oz (higher available upon request) | Min Line Width/Spacing | 0.1mm/0.1mm (4mil/4mil) |
| Min Drilled Hole Size | 0.2mm (laser drilling), 0.3mm (mechanical drilling) | Thermal Conductivity | 0.3-2.0W/mK (FR4), 100-400W/mK (Metal Core) |
| CTE (Coefficient of Thermal Expansion) | 11-16 ppm/°C | Surface Finishes | ENIG, HASL, Immersion Silver, OSP |
| Solder Mask Colors | Green, Blue, Black, White, Red | Testing Methods | Thermal shock test, Impedance test, X-ray inspection |
| Plated Holes Tolerance | 0.08mm(min±0.05) | Non-plated Hole Tolerance | 0.05min(min+0/-0.05mm or +0.05/-0mm) |
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