Material Selection – Choosing specialized laminates with low dielectric constant (Dk) and low loss tangent, such as PTFE (Teflon) or ceramics, to minimize signal attenuation.
Layer Stacking – Carefully stacking layers with controlled impedance to maintain signal integrity.
Copper Lamination – Bonding copper foil to the substrate material with high precision for reliable electrical conductivity.
Etching & Imaging – Using photolithography and advanced etching to create fine traces while minimizing signal distortion.
Drilling – High-precision drilling for vias to ensure effective electrical connections.
Surface Treatment – Applying finishes like ENIG or OSP to enhance solderability and reduce signal degradation.
Testing & Inspection – Rigorous testing for electrical performance and high-frequency signal reliability.
High-frequency PCBs are designed with materials like PTFE or ceramics to minimize signal loss and ensure high-speed signal integrity. The manufacturing process includes precise layer stacking, copper lamination, fine etching, and high-precision drilling. These PCBs are ideal for RF communication, satellite systems, and high-speed data processing, providing reliable performance in demanding, high-frequency applications.
High-frequency PCBs are vital in wireless communication (5G, Wi-Fi 6E), automotive electronics (ADAS, V2X), medical equipment (MRI, biosensors), industrial control (IIoT, automation), and defense/aviation (radar, satellites). They offer low loss, precise impedance control, and high reliability, enabling high-speed data transmission, signal integrity, and stability in extreme environments. These PCBs support miniaturization, high power, and efficient signal processing, driving advancements in global connectivity, smart technologies, and mission-critical systems.
| Manufacturing Capabilities | Specifications | ||
|---|---|---|---|
| RF PCB layer quantity | 2 to 24 | Minimum line width/line spacing | 2.5mil/2.5mil |
| High-frequency PCB types | 6GHz to 24GHz PCB, 70GHz PCB, embedded antenna PCB, ceramic high-frequency PCB, PTFE high-frequency PCB, Rogers PCB | Minimum aperture | 0.15mm |
| Finished PCB thickness | 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm | Dielectric constant (Dk) | 2.2~3.5 (common high-frequency material range) |
| Base copper thickness | Normally 0.5oz and 1.0oz | Dissipation factor (Df) | 0.0009~0.005 |
| Conductor width control | ±0.02mm | Surface treatment | ENIG, OSP, LFHASL, gold plating, nickel-palladium-gold, etc. |
| Maximum impedance control tolerance | 2% | Impedance control accuracy | ±5% |
| PCB vias we can drill | Blind via, overlapping via, staggered via, skip via, buried via | High frequency test | Time domain reflection test (TDR), network analyzer test |
| Thermal stress | 10 seconds at 288°C | Inter-layer alignment accuracy | ±50μm |
| Hole wall copper thickness | ≥ 20μм | Surface finish | 0.1μm~0.4μm |
| Punching or routing tolerance | ±0.10mm to 0.13mm | Solder mask thickness on traces | 20μm to 30μm |
| Solder mask ink | Taiyo PSR4000, Tamura DSR2200 | High frequency test capability | TDR, VNA (vector network analyzer), thermal shock test, etc. |
Tel: +86 (0)755-2561-8511
Email: sales@scspcba.com
US Add: 1363 Lincoln Ave, Suite 1, Holbrook, NY
China Add: Building 4, No. 33, AnSheng Road, Shajing Town, BaoAn district, Shenzhen, China.
Wuhan Add: Room 602, Ward Center, No.780 Gaoxin Avenue, East Lake High-tech Development Zone, Wuhan, China
