Multilayer PCB

Multilayer PCB Manufacturing Process

Material Selection – Choosing high-quality base materials like FR4 for the core and prepreg for intermediate layers.

Layer Stacking – Aligning copper foils, prepreg, and core materials for each layer’s design.

Lamination – Pressing the layers under heat and pressure to form a solid, multi-layer structure.

Drilling & Plating – Drilling microvias and plating them with copper to establish inter-layer connections.

Etching & Imaging – Creating precise circuit patterns on each layer through etching and photolithography.

Testing & Inspection – Conducting electrical and mechanical tests to ensure performance and reliability.

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Manufacturing Features of Multilayer PCB

PCBs use FR4, high-frequency materials (e.g., Rogers), aluminum, ceramic, or polyimide for flexibility. Copper foil thickness ranges from 0.5oz to 2oz or more. Layer count varies from 4 to 32+, with high-end designs exceeding 50. Via types include THV, blind, buried, and microvias. Surface finishes like HASL, ENIG, and immersion silver optimize performance. A well-designed stack-up ensures signal integrity, thermal management, and mechanical strength.

Application Fields of Multilayer PCB

Multilayer PCBs are widely used in advanced applications requiring high performance, compact design, and reliability, including:

Telecommunications: Found in high-speed networking equipment, 5G infrastructure, routers, and satellite systems.
Medical Devices: Used in imaging systems (MRI, CT scans), diagnostic tools, and patient monitoring devices.
Automotive Electronics: Essential in advanced driver-assistance systems (ADAS), engine control units (ECUs), and infotainment systems.
Aerospace & Defense: Utilized in radar systems, avionics, missile guidance, and satellite communication.
Industrial Automation: Applied in robotics, power distribution units, and embedded computing systems.
Consumer Electronics: Found in smartphones, tablets, smartwatches, and gaming consoles.
Computing & Data Centers: Used in high-speed servers, AI processors, GPUs, and cloud computing infrastructure.

SCSPCBA’s Multilayer PCB Manufacturing Capabilities

PCB Board Fabrication Capabilities
Multilayer PCB Item		Multilayer PCB Capability
PCB layer quantity	3 to 64	HDI PCB stack-up	1+N+1, 2+N+2, 3+N+3, 4+N+4
Finished PCB thickness	0.15mm to 3.2mm	Aspect ratio	(laser drill) 3:4 (PTH) 10:1
PCB materials	FR4, PTFE, PI, PET, aluminum, copper, ceramics	Punching profile	±3mil
Copper thickness	1/3oz to 7oz	Hole size tolerance	PTH: ±3mil, NPTH: ±2mil
Tg (FR4 multilayer PCB)	135°C, 150°C, 160°C, 170°C, 180°C, 185°C, 200°C…	Hole position tolerance	±2mil
Min. drill bit size	8mil	Routing tolerance	±4mil
Min. trace space/width	(inner layers)2.5mil/2.5mil (external layers)2.5mil/2.5mil	Single-ended impedance	±10%
PCB assembly Min. pitch	0.35mm	Differential control	±10%
Surface finish	HASL: SMD 40µ to 2000µ”, GND 30µ to 800µ”, ENIG: Au 1µ to 5µ”, Ni 80µ to 200µ”, Immersion tin: 0.8µm to 1.2µm Immersion silver: 0.15µm to 0.45µm Hard gold plating: Au 1µ to 50µ”, Ni 80µ to 200µ” Peelable mask: 5mil Carbon ink: 0.3mil	Board Thickness:D/S	0.2-7.0mm, Multilayers:0.40-7.0mm