Custom Multilayer Circuit Boards Tailored to Your Specifications
Characteristics of Multilayer PCB
Multilayer PCBs (MLPCBs) consist of three or more conductive copper layers, separated by insulating layers, and laminated together. Their key characteristics include:
- High Circuit Density: Allows for complex and compact circuit designs, reducing overall board size.
- Enhanced Signal Integrity: Internal ground and power planes improve signal stability and reduce electromagnetic interference (EMI).
- Better Power Distribution: Dedicated power and ground layers enhance power integrity, making them suitable for high-speed circuits.
- Increased Design Flexibility: More layers provide routing options, enabling optimized layouts for high-performance applications.
- Higher Manufacturing Cost: Compared to single and double-layer PCBs, multilayer PCBs involve a more complex fabrication process, increasing production costs.
- More Difficult Repair and Rework: Due to their complexity and dense layer stacking, repairing or modifying multilayer PCBs is challenging.
Multilayer PCB
Manufacturing Features of Multilayer PCB
- Base Material: Typically FR4, but also available in high-frequency materials (e.g., Rogers), aluminum-based, ceramic-based, or polyimide for flexibility.
- Copper Foil Thickness: Standard options include 1oz (35µm), with alternatives like 0.5oz (18µm), 2oz (70µm), or more for specific applications.
- Layer Count: Ranges from 4 to 32 layers, with some high-end applications exceeding 50 layers.
- Via Types: Includes through-hole vias (THV), blind vias, buried vias, and microvias for interlayer connections.
- Surface Finish Options: Common finishes include HASL, ENIG, immersion silver, immersion tin, and OSP, depending on application requirements.
- Stack-Up Design: Careful layer arrangement ensures signal integrity, thermal management, and mechanical strength.
Application Fields of Multilayer PCB
Multilayer PCBs are widely used in advanced applications requiring high performance, compact design, and reliability, including:
- Telecommunications: Found in high-speed networking equipment, 5G infrastructure, routers, and satellite systems.
- Medical Devices: Used in imaging systems (MRI, CT scans), diagnostic tools, and patient monitoring devices.
- Automotive Electronics: Essential in advanced driver-assistance systems (ADAS), engine control units (ECUs), and infotainment systems.
- Aerospace & Defense: Utilized in radar systems, avionics, missile guidance, and satellite communication.
- Industrial Automation: Applied in robotics, power distribution units, and embedded computing systems.
- Consumer Electronics: Found in smartphones, tablets, smartwatches, and gaming consoles.
- Computing & Data Centers: Used in high-speed servers, AI processors, GPUs, and cloud computing infrastructure.
SCSPCBA’s Multilayer PCB Manufacturing Capabilities
| Multilayer PCB Item | Multilayer PCB Capability | ||
|---|---|---|---|
| PCB layer quantity | 3 to 64 | HDI PCB stack-up | 1+N+1, 2+N+2, 3+N+3, 4+N+4 |
| Finished PCB thickness | 0.15mm to 3.2mm | Aspect ratio | (laser drill) 3:4 (PTH) 10:1 |
| PCB materials | FR4, PTFE, PI, PET, aluminum, copper, ceramics | Punching profile | ±3mil |
| Copper thickness | 1/3oz to 7oz | Hole size tolerance | PTH: ±3mil, NPTH: ±2mil |
| Tg (FR4 multilayer PCB) | 135°C, 150°C, 160°C, 170°C, 180°C, 185°C, 200°C… | Hole position tolerance | ±2mil |
| Min. drill bit size | 8mil | Routing tolerance | ±4mil |
| Min. trace space/width | (inner layers)2.5mil/2.5mil (external layers)2.5mil/2.5mil | Single-ended impedance | ±10% |
| PCB assembly Min. pitch | 0.35mm | Differential control | ±10% |
| Surface finish | HASL: SMD 40µ to 2000µ”, GND 30µ to 800µ”, ENIG: Au 1µ to 5µ”, Ni 80µ to 200µ”, Immersion tin: 0.8µm to 1.2µm Immersion silver: 0.15µm to 0.45µm Hard gold plating: Au 1µ to 50µ”, Ni 80µ to 200µ” Peelable mask: 5mil Carbon ink: 0.3mil | Board Thickness:D/S | 0.2-7.0mm, Multilayers:0.40-7.0mm |
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