Single Layer PCB

Single-Layer PCB Manufacturing Process

Material Selection – Choosing a substrate material like FR4, coated with a thin layer of copper foil on one side.

Lamination – Bonding the copper foil to the substrate through heat and pressure.

Etching & Imaging – Using photolithography to transfer the circuit design onto the copper layer, followed by etching to remove excess copper.

Drilling – Drilling holes for vias, components, and mounting pins.

Surface Treatment – Applying surface finishes such as HASL, OSP, or ENIG to enhance solderability and prevent oxidation.

Testing & Inspection – Conducting electrical testing to ensure the circuit’s functionality and quality.

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Manufacturing Features of Single-Layer PCB

Substrate Material: Common materials include FR4 (fiberglass), CEM-1, CEM-3, or paper-based substrates (such as FR1, FR2).
Copper Foil Thickness: Standard thickness options include 1oz (35µm), with alternatives like 0.5oz (18µm) or 2oz (70µm).
Surface Finishing: Options include OSP (Organic Solderability Preservative), HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), and Silver Plating.
Processing Method: Uses an etching process to remove excess copper and form circuits; drilling is used for component mounting.

Application Fields of Single-Layer PCB

Due to its cost-effectiveness and easy production, single-layer PCBs are widely used in various low-complexity electronic products, including:

Consumer Electronics: Calculators, toys, radios, and other simple electronic devices.
Home Appliances: Control circuits in rice cookers, fans, washing machines, microwaves, etc.
LED Lighting: Widely used in LED drivers and lighting fixtures such as LED strips and streetlights.
Automotive Electronics: Car audio systems, lighting control circuits, and other simple vehicle electronics.
Power Modules: AC-DC, DC-DC converters, and power management circuits.
Industrial Control: Basic control panels, sensor modules, and other low-end industrial applications.

SCSPCBA’s Single-Layer PCB Manufacturing Capabilities

PCB Board Fabrication Capabilities
Single Sided PCB Item		Single Sided PCB Capability
Number of Layers	1 layer	Surface Finish	OSP, HASL, Lead-free HASL, ENIG, Silver Plating
Max Board Size	1200mm × 600mm (depending on factory capability)	Solder Mask Colors	Green, Blue, White, Black, Red, Yellow
Min Board Thickness	0.4mm	Final Tolerance	±0.1mm
Max Board Thickness	3.2mm	Warping	≤0.75%
Base Material	FR4, CEM-1, CEM-3, Paper-based (FR1, FR2), Aluminum-based	Hole Copper Thickness	≥20µm
Copper Foil Thickness	0.5oz (18µm), 1oz (35µm), 2oz (70µm)	Testing Method	Flying probe test, test jig
Min Line Width/Spacing	0.1mm/0.1mm (4mil/4mil)	Products Type	HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board , BGA& Fine Pitch board
Min Drilled Hole Diameter	0.2mm (8mil)	Functional Test	Insulating resistance : 50 ohms (mormality)

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Tel: +86 (0)755-2561-8511

Email: sales@scspcba.com

US Add: 1363 Lincoln Ave, Suite 1, Holbrook, NY

China Add: Room 203, Building B, No. 229, Wanfeng Middle Road, Wanfeng Community, Xinqiao Street, Bao’an District, Shenzhen

Wuhan Add: Room 602, Ward Center, No.780 Gaoxin Avenue, East Lake High-tech Development Zone, Wuhan, China

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Single Layer PCB

Single-Layer PCB Manufacturing Process

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Single-Layer PCB

Manufacturing Features of Single-Layer PCB

Application Fields of Single-Layer PCB

SCSPCBA’s Single-Layer PCB Manufacturing Capabilities

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