Single Layer PCB

Single-Layer PCB Manufacturing Process

Material Selection – Choosing a substrate material like FR4, coated with a thin layer of copper foil on one side.

Lamination – Bonding the copper foil to the substrate through heat and pressure.

Etching & Imaging – Using photolithography to transfer the circuit design onto the copper layer, followed by etching to remove excess copper.

Drilling – Drilling holes for vias, components, and mounting pins.

Surface Treatment – Applying surface finishes such as HASL, OSP, or ENIG to enhance solderability and prevent oxidation.

Testing & Inspection – Conducting electrical testing to ensure the circuit’s functionality and quality.

Manufacturing Features of Single-Layer PCB

  • Substrate Material: Common materials include FR4 (fiberglass), CEM-1, CEM-3, or paper-based substrates (such as FR1, FR2).
  • Copper Foil Thickness: Standard thickness options include 1oz (35µm), with alternatives like 0.5oz (18µm) or 2oz (70µm).
  • Surface Finishing: Options include OSP (Organic Solderability Preservative), HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), and Silver Plating.
  • Processing Method: Uses an etching process to remove excess copper and form circuits; drilling is used for component mounting.

Application Fields of Single-Layer PCB

Due to its cost-effectiveness and easy production, single-layer PCBs are widely used in various low-complexity electronic products, including:

  • Consumer Electronics: Calculators, toys, radios, and other simple electronic devices.
  • Home Appliances: Control circuits in rice cookers, fans, washing machines, microwaves, etc.
  • LED Lighting: Widely used in LED drivers and lighting fixtures such as LED strips and streetlights.
  • Automotive Electronics: Car audio systems, lighting control circuits, and other simple vehicle electronics.
  • Power Modules: AC-DC, DC-DC converters, and power management circuits.
  • Industrial Control: Basic control panels, sensor modules, and other low-end industrial applications.

SCSPCBA’s Single-Layer PCB Manufacturing Capabilities

PCB Board Fabrication Capabilities
Single Sided PCB ItemSingle Sided PCB Capability
Number of Layers

1 layerSurface FinishOSP, HASL, Lead-free HASL, ENIG, Silver Plating
Max Board Size
1200mm × 600mm (depending on factory capability)Solder Mask Colors
Green, Blue, White, Black, Red, Yellow
Min Board Thickness
0.4mmFinal Tolerance ±0.1mm
Max Board Thickness
3.2mmWarping
≤0.75%
Base MaterialFR4, CEM-1, CEM-3, Paper-based (FR1, FR2), Aluminum-basedHole Copper Thickness ≥20µm
Copper Foil Thickness0.5oz (18µm), 1oz (35µm), 2oz (70µm)Testing MethodFlying probe test, test jig
Min Line Width/Spacing0.1mm/0.1mm (4mil/4mil)
Products TypeHF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,
BGA& Fine Pitch board
Min Drilled Hole Diameter0.2mm (8mil)Functional Test
Insulating resistance : 50 ohms (mormality)

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