SMT/DIP

Introduction to SMT/DIP

SMT (Surface Mount Technology) and DIP (Dual In-line Package) are two major circuit board assembly methods in the electronics manufacturing industry.
SMT is primarily used for high-density, miniaturized electronic products such as smartphones and automotive electronics, offering high precision and efficiency.
DIP is mainly used for traditional through-hole components, suitable for high-power and high-reliability applications such as industrial control and automotive electronics.
We provide one-stop SMT placement and DIP assembly services to meet various customer needs.

PCBA Service

SMT/DIP

SMT Assembly Process

SMT is a technology that directly mounts electronic components onto the PCB using solder paste and reflow soldering.

Process Flow:

  • Solder Paste Printing – Applying solder paste onto PCB pads using high-precision stencils and automatic printers.
  • SPI (Solder Paste Inspection) – Ensuring proper solder paste thickness and distribution using 3D solder paste inspection.
  • High-speed Component Placement – Using high-precision SMT pick-and-place machines to accurately mount various SMD components (e.g., resistors, capacitors, ICs) onto the PCB.
  • Reflow Soldering – The PCB enters a reflow oven, where the solder paste melts under a controlled temperature curve to complete component soldering.
  • AOI (Automated Optical Inspection) – Using high-resolution cameras to check solder joint quality and detect defects such as missing solder, bridging, or misalignment.
  • X-ray Inspection (for BGA/QFN packages) – Examining internal soldering quality to ensure no voids or cracks.

DIP Through-Hole Assembly Process

The DIP process is used for traditional through-hole components, commonly found in high-reliability or high-power products.

Process Flow:

  • Component Preparation – Pre-processing of DIP components, such as taping, forming, and cutting.
  • Manual Insertion / Automated Insertion – Inserting components into PCB holes using automated insertion machines or manual assembly.
  • Wave Soldering (for mass production):
    The PCB passes through preheating, flux application, and wave soldering stages, where molten solder forms secure electrical connections.
  • Manual Soldering (for small batches or specific components) – Hand soldering is used for certain components that cannot be wave soldered, such as high-power devices.
  • Inspection & Rework – Conducting AOI and ICT testing to verify soldering quality and correct defects if needed.

Manufacturing Equipment & Process Reliability

Our SMT/DIP production lines are equipped with state-of-the-art automation equipment to ensure production efficiency and product quality.

Key Equipment:

  • SMT Equipment: High-precision pick-and-place machines (Panasonic/NXT/Samsung), capable of handling 0402, BGA, QFN, and other micro components.
  • Inspection Equipment: AOI, SPI, X-ray, ICT, FCT, ensuring 100% quality control.
  • DIP Equipment: Automatic insertion machines, wave soldering systems, and manual soldering stations to accommodate various assembly needs.

Our Advantages

  • High Precision & Stability – SMT machines with ±0.02mm accuracy ensure reliable soldering quality.
  • Comprehensive Quality Control – Strict QC processes from solder paste printing to final testing, minimizing defect rates.
  • Flexible Production Capabilities – Supporting small-batch prototyping and mass production.
  • One-stop PCBA Service – Covering component sourcing, PCB fabrication, SMT/DIP assembly, testing, and packaging.
  • Fast Delivery – Standard lead time of 3-7 days, with expedited options available within 24 hours.

Industry Applications

Our SMT/DIP services are widely used in the following industries:

  • Automotive Electronics (car navigation systems, dashcams, smart rearview mirrors)
  • Consumer Electronics (smart wearables, Bluetooth headsets, wireless chargers)
  • Medical Devices (blood pressure monitors, ECG monitors, temperature sensors)
  • Industrial Control (motor drivers, inverters, smart meters)
  • Telecommunication Equipment (Wi-Fi modules, routers, 5G base stations)

Quality Control & Testing

To ensure the reliability of PCBA products, we implement the following inspection methods:

  • SPI Inspection – Checks solder paste printing quality to prevent bridging or insufficient solder.
  • AOI Inspection – Automated optical inspection of placement accuracy and solder joint quality to detect missing or reversed components.
  • X-ray Inspection – Used for BGA, QFN, and hidden solder joints to ensure proper internal connections.
  • ICT Testing (In-Circuit Test) – Electrical performance testing of circuits, including voltage, current, and short circuits.
  • FCT Testing (Functional Test) – Simulates real-world operation to verify the full functionality of PCBA boards.
  • Aging Test – Long-term operational testing to ensure stabili

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