Testing & Inspection

Introduction to Testing & Inspection

Rigorous testing and inspection are essential in the PCBA manufacturing process to reduce defect rates and ensure product reliability and stability.
We offer a comprehensive range of testing solutions, including Automated Optical Inspection (AOI), X-ray Inspection, In-Circuit Testing (ICT), Functional Circuit Testing (FCT), and Burn-in Testing, ensuring that every PCBA meets the highest quality standards.
Our inspection procedures strictly follow ISO 9001, IPC standards, and specific customer requirements to ensure full quality verification before shipment.

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Testing & Inspection

Quality Control Process

We implement strict quality control at every stage of PCBA production to minimize defects and ensure product reliability.
Key Quality Control Stages:

  • Incoming Quality Control (IQC): Evaluating the quality of raw materials to ensure components meet specifications.
  • In-Process Quality Control (IPQC): Conducting key process inspections, such as solder paste printing, placement, and reflow soldering.
  • Final Quality Control (FQC): Performing final inspections after assembly, including visual checks and functional testing.
  • Outgoing Quality Control (OQC): Conducting random sampling before packaging and shipping to ensure products meet customer requirements.

(Quality Control Flowchart)

Automated Optical Inspection (AOI)

AOI is an automated inspection technology that uses high-resolution cameras and AI algorithms to detect solder joint quality.
Inspection Scope:

  • Solder paste printing defects (e.g., insufficient solder, bridging)
  • Component misalignment, missing components, incorrect placement, polarity reversal
  • Poor soldering (e.g., cold joints, tombstoning, solder ball issues)

Advantages:

  • Fast inspection speed, ideal for mass production
  • Non-contact inspection, does not damage the PCBA
  • High-resolution imaging ensures accurate defect detection

X-ray Inspection

X-ray inspection is used to check the soldering quality of BGA, QFN, and other hidden components, detecting internal defects that are invisible to the naked eye or AOI.
Inspection Scope:

  • BGA solder ball quality (e.g., voids, misalignment)
  • Internal short circuits or open circuits
  • Multilayer PCB connectivity verification

Advantages:

  • Non-destructive testing for internal solder joints
  • Ensures hidden defects are identified before shipment

In-Circuit Testing (ICT)

ICT is a method that uses a bed-of-nails test fixture to directly contact PCB test points, mainly for evaluating the electrical performance of PCBA.Inspection Scope:

  • Resistance, capacitance, and inductance values
  • Voltage, current, and power measurements
  • Short circuit and open circuit detection

Advantages:

  • Fast testing speed, suitable for large-scale production
  • Provides precise electrical parameter data for design optimization

Functional Circuit Testing (FCT)

FCT verifies the complete functionality of the PCBA by simulating its real-world operating conditions.
Inspection Scope:

  • Power-on testing to check circuit operation
  • Testing sensors, communication interfaces, and wireless modules
  • Verifying MCU, processors, and memory functionality
  • Checking interactive components such as buttons, LEDs, and displays

Advantages:

  • Simulates real-use scenarios to ensure full product functionality
  • Essential for complex circuit designs and smart electronic products

Burn-in Testing

Burn-in testing applies high temperatures, loads, and environmental stress to the PCBA to verify long-term stability.
Testing Methods:

  • High-temperature aging: Operating the PCBA at 85°C for 24 hours
  • Continuous load testing: Running the board under full load for an extended period
  • Temperature cycling: Alternating between -40°C and 85°C

Advantages:

  • Detects early failures, improving overall product reliability
  • Ensures the PCBA withstands harsh operating environments

Reliability Testing

Reliability testing evaluates PCBA performance under various environmental conditions to ensure long-term stability.
Testing Scope:

  • Temperature & Humidity Testing (e.g., high humidity at 85% RH)
  • Mechanical Shock & Vibration Testing (simulating transportation and drop scenarios)
  • Salt Spray Testing (evaluating corrosion resistance)
  • EMC/EMI Testing (assessing electromagnetic compatibility)

Advantages:

  • Predicts product lifespan under different conditions
  • Suitable for high-reliability industries such as automotive, aerospace, and medical devices

(AOI, X-ray, ICT, FCT, etc.)

Quality Certifications

Our PCBA testing and inspection processes adhere to international quality standards, and we hold multiple certifications:
ISO 9001: Quality Management System
ISO 13485: Medical Device Quality Management System
IATF 16949: Automotive Industry Quality Standard
RoHS & REACH: Compliance with environmental regulations

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