Testing & Inspection

Introduction to Testing ＆ Inspection

Rigorous testing and inspection are essential in the PCBA manufacturing process to reduce defect rates and ensure product reliability and stability.
We offer a comprehensive range of testing solutions, including Automated Optical Inspection (AOI), X-ray Inspection, In-Circuit Testing (ICT), Functional Circuit Testing (FCT), and Burn-in Testing, ensuring that every PCBA meets the highest quality standards.
Our inspection procedures strictly follow ISO 9001, IPC standards, and specific customer requirements to ensure full quality verification before shipment.

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Quality Control Process

We implement strict quality control at every stage of PCBA production to minimize defects and ensure product reliability.
Key Quality Control Stages:

Incoming Quality Control (IQC): Evaluating the quality of raw materials to ensure components meet specifications.
In-Process Quality Control (IPQC): Conducting key process inspections, such as solder paste printing, placement, and reflow soldering.
Final Quality Control (FQC): Performing final inspections after assembly, including visual checks and functional testing.
Outgoing Quality Control (OQC): Conducting random sampling before packaging and shipping to ensure products meet customer requirements.

（Quality Control Flowchart）

Printed Circuit Assembly Quality Control Flowchart

Automated Optical Inspection (AOI)

AOI is an automated inspection technology that uses high-resolution cameras and AI algorithms to detect solder joint quality.
Inspection Scope:

Solder paste printing defects (e.g., insufficient solder, bridging)
Component misalignment, missing components, incorrect placement, polarity reversal
Poor soldering (e.g., cold joints, tombstoning, solder ball issues)

Advantages:

Fast inspection speed, ideal for mass production
Non-contact inspection, does not damage the PCBA
High-resolution imaging ensures accurate defect detection

X-ray Inspection

X-ray inspection is used to check the soldering quality of BGA, QFN, and other hidden components, detecting internal defects that are invisible to the naked eye or AOI.
Inspection Scope:

BGA solder ball quality (e.g., voids, misalignment)
Internal short circuits or open circuits
Multilayer PCB connectivity verification

Advantages:

Non-destructive testing for internal solder joints
Ensures hidden defects are identified before shipment

Flexible PCB and PCBA Testing ＆ Inspection

In-Circuit Testing (ICT)

ICT is a method that uses a bed-of-nails test fixture to directly contact PCB test points, mainly for evaluating the electrical performance of PCBA.Inspection Scope:

Resistance, capacitance, and inductance values
Voltage, current, and power measurements
Short circuit and open circuit detection

Advantages:

Fast testing speed, suitable for large-scale production
Provides precise electrical parameter data for design optimization

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Functional Circuit Testing (FCT)

FCT verifies the complete functionality of the PCBA by simulating its real-world operating conditions.
Inspection Scope:

Power-on testing to check circuit operation
Testing sensors, communication interfaces, and wireless modules
Verifying MCU, processors, and memory functionality
Checking interactive components such as buttons, LEDs, and displays

Advantages:

Simulates real-use scenarios to ensure full product functionality
Essential for complex circuit designs and smart electronic products

printed circuit board testing

Burn-in Testing

Burn-in testing applies high temperatures, loads, and environmental stress to the PCBA to verify long-term stability.
Testing Methods:

High-temperature aging: Operating the PCBA at 85°C for 24 hours
Continuous load testing: Running the board under full load for an extended period
Temperature cycling: Alternating between -40°C and 85°C

Advantages:

Detects early failures, improving overall product reliability
Ensures the PCBA withstands harsh operating environments

testing pcb boards

Reliability Testing

Reliability testing evaluates PCBA performance under various environmental conditions to ensure long-term stability.
Testing Scope:

Temperature & Humidity Testing (e.g., high humidity at 85% RH)
Mechanical Shock & Vibration Testing (simulating transportation and drop scenarios)
Salt Spray Testing (evaluating corrosion resistance)
EMC/EMI Testing (assessing electromagnetic compatibility)

Advantages:

Predicts product lifespan under different conditions
Suitable for high-reliability industries such as automotive, aerospace, and medical devices

（AOI, X-ray, ICT, FCT, etc.）

Professional printed circuit assembly manufacturing process

Quality Certifications

Our PCBA testing and inspection processes adhere to international quality standards, and we hold multiple certifications:
ISO 9001: Quality Management System
ISO 13485: Medical Device Quality Management System
IATF 16949: Automotive Industry Quality Standard
RoHS & REACH: Compliance with environmental regulations Printed Circuit Assembly Quality Certifications

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SUCCESS CIRCUITS GPOUP LIMITED

Tel: +86 (0)755-2561-8511

Email: sales@scspcba.com

US Add: 1363 Lincoln Ave, Suite 1, Holbrook, NY

China Add: Room 203, Building B, No. 229, Wanfeng Middle Road, Wanfeng Community, Xinqiao Street, Bao’an District, Shenzhen

Wuhan Add: Room 602, Ward Center, No.780 Gaoxin Avenue, East Lake High-tech Development Zone, Wuhan, China

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Testing & Inspection

Introduction to Testing ＆ Inspection

PCBA Service

Testing & Inspection

Quality Control Process

Automated Optical Inspection (AOI)

X-ray Inspection

In-Circuit Testing (ICT)

Functional Circuit Testing (FCT)

Burn-in Testing

Reliability Testing

Quality Certifications

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