Enhance Durability and Performance with Heavy Copper Circuit Board Manufacturing
Characteristics of Thick Copper PCB
Thick Copper PCBs are designed for high-current, high-power, and thermal management applications. They feature an increased copper thickness that enhances durability and conductivity. Key characteristics include:
- High Current-Carrying Capacity: Thick copper layers (typically 3oz to 20oz, or even up to 200oz in extreme cases) allow for the transmission of high currents without excessive heat buildup.
- Superior Heat Dissipation: Effective in handling high temperatures, reducing the risk of thermal damage to components.
- Enhanced Mechanical Strength: The increased copper thickness reinforces the board structure, making it more durable and reliable in harsh environments.
- Improved Reliability: Withstand repeated thermal cycling and mechanical stress, making them suitable for power electronics.
- Lower Impedance Power Distribution: Ensures stable voltage supply across circuits, reducing power losses.
- Complex Circuit Design Compatibility: Supports multi-layer and heavy copper plating for advanced electrical performance.
- High-Voltage Applications: Suitable for applications requiring high voltage tolerance due to improved dielectric spacing.
Thick-copper PCB
Manufacturing Features of Thick Copper PCB
1. Base Materials
- FR4 (Standard and High-TG)
- Polyimide
- Metal Core (Aluminum or Copper Base)
2. Copper Thickness
- 3oz to 20oz standard (up to 200oz for specialized applications)
3. Layer Count
- Typically 1-10 layers, with some designs supporting higher multilayers
4. Thermal Management Techniques
- Thermal vias for heat dissipation
- Metal heat sinks or integrated copper inlays
5. Etching Process Considerations:
- Requires special etching techniques to ensure precision in thick copper layer
6. Plating and Surface Finishes
- Heavy copper electroplating to build up copper thickness
- ENIG (Electroless Nickel Immersion Gold), HASL (Hot Air Solder Leveling), Immersion Silver, and OSP (Organic Solderability Preservative)
7. Minimum Line Width/Spacing
- Typically 0.3mm/0.3mm (12mil/12mil), depending on copper thickness
8. Minimum Drilled Hole Size
- 0.3mm mechanical drilling, 0.2mm laser drilling
Application Fields of Thick Copper PCB
- Power Electronics & Industrial Equipment: Power distribution systems, High-power rectifiers and converters, Industrial motor controllers
- Automotive & Electric Vehicles (EVs): Battery management systems (BMS), High-power LED drivers, Electric power steering (EPS)
- Renewable Energy & Power Grids: Solar power inverters, Wind turbine power controllers, Smart grid power monitoring
- Military & Aerospace: Radar and defense communication systems, High-power avionics and navigation controls, Harsh-environment applications
- Medical Equipment: High-power medical imaging devices (MRI, CT scanners), Electrosurgical instruments
SCSPCBA’s Thick Copper PCB Manufacturing Capabilities
| Thick Copper PCB Item | Thick Copper PCB Capability | ||
|---|---|---|---|
| Thick Copper PCB Layer Quantity | 1 to 10 | Min Board Thickness | 0.8mm |
| PCB Copper Thickness | 3oz to 14oz | Max Board Thickness | 10mm (depends on copper thickness) |
| Dielectric Constant | 4.2-4.7 (FR4), 6-10 (Polyimide) | Base Materials | FR4 (Standard & High-TG), Polyimide, Aluminum Core, Copper Core |
| Thick-copper PCB Thickness | 0.5mm to 8mm | Min Line Width/Spacing | 0.3mm/0.3mm (12mil/12mil), depends on copper thickness |
| Solder Mask Technology | Electrostatic spray solder mask | Min Drilled Hole Diameter | 0.3mm (mechanical drilling), 0.2mm (laser drilling) |
| Circuit Etching Tolerance | ±5% | Via Types | Plated Through-Hole (PTH), Thermal Vias, Buried & Blind Vias |
| Solder Mask Color | Green, black, blue, white, red, mink, yellow | Thermal Conductivity | 2-5W/mK (FR4), 100-400W/mK (Metal Core) |
| Surface Finish | HASL: SMD 40µ to 2000µ”, GND 30µ to 800µ” ENIG: Au 1µ to 5µ”, Ni 80µ to 200µ” Immersion tin: 0.8µm to 1.2µm Immersion silver: 0.15µm to 0.45µm Hard gold plating: Au 1µ to 50µ”, Ni 80µ to 200µ” Peelable mask: 5mil Carbon ink: 0.3mil | Min. Trace Width/Space | 3oz – 6.5mil/6.5mil 4oz – 8mil/8mil 5oz – 9.5mil/9.5mil 6oz – 11mil/11mil 7oz – 12.5mil/12.5mil 8oz – 14mil/14mil 9oz – 15.5mil/15.5mil 10oz – 17mil/17mil 11oz – 18.5mil/18.5mil 12oz – 21mil/21mil 13oz – 22.5mil/22.5mil 14oz – 24mil/24mil |
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