End-to-End Ultra-high-layer PCB Board Fabrication
Characteristics of Ultra-High-Layer PCB
Ultra-high-layer PCBs (16-50 layers) are designed for complex, high-performance electronic applications requiring multiple signal, power, and ground layers. Their key characteristics include:
- High Circuit Density: Accommodates multiple signal layers, power planes, and ground planes within a compact structure.
- Superior Electrical Performance: Provides excellent signal integrity, impedance control, and reduced electromagnetic interference (EMI).
- Advanced Thermal Management: Utilizes thermal vias, heat sinks, and special materials to handle high-power applications.
- Reliable Power Distribution: Dedicated power and ground layers ensure stable voltage and current flow.
- Complex Manufacturing Process: Requires precise layer alignment, drilling, and lamination to maintain quality and performance.
- Higher Cost: Due to the advanced materials, processing steps, and testing involved, ultra-high-layer PCBs are more expensive than standard multilayer PCBs.
- Heavy Copper Option: Can support up to 6oz copper thickness for high-current applications.
Microvia and HDI Integration: Microvias are often designed with blind, buried, and stacked micro vias to optimize space and performance.
High-Reliability Design: Used in mission-critical applications where durability, signal integrity, and thermal stability are essential.
Ultra-High-Layer PCB
Manufacturing Features of Ultra-High-Layer PCB
1. Base Materials
- High-Tg FR4 (Tg170–Tg260)
- Rogers high-frequency materials (RO4000, RO3000 series)
- PTFE (Teflon) for RF applications
- Ceramic-based composites for high-temperature environments
- Polyimide for extreme durability and flex-rigid hybrid applications
2. Layer Count
- Typically ranges from 16 to 50 layers, with some specialized designs exceeding 50 layers
3. Copper Thickness
- Depending on current-carrying requirements, 0.5oz (18µm) to 6oz (210µm)
4. Min Line Width/Spacing
- 0.075mm/0.075mm (3mil/3mil), depending on manufacturing capability.
5. Min Drilled Hole Diameter
- Mechanical drilling: 0.2mm (8mil)
- Laser drilling (microvias): 0.075mm (3mil)
6. Via Types
- Through-hole vias (THV)
- Blind vias and buried vias
- Stacked and staggered microvias (HDI integration)
- Via-in-pad technology for high-density connections
7. Stack-Up Design Considerations
- Includes alternating signal, power, and ground planes for noise reduction and stable signal transmission.
Application Fields of Ultra-High-Layer PCB
Ultra-high-layer PCBs are widely used in cutting-edge industries requiring high performance, signal integrity, and thermal management, including:
Telecommunications & Networking
5G base stations and high-speed data centers
High-frequency RF communication systems
Optical fiber transmission equipment
Aerospace & Defense
Avionics and military radar systems
Spacecraft communication modules
Missile guidance and satellite systems
Medical Equipment
MRI and CT scan imaging systems
Advanced diagnostic and monitoring devices
Automotive & Electric Vehicles
Advanced driver-assistance systems (ADAS)
LiDAR and radar sensors for autonomous driving
Electric vehicle (EV) power distribution modules
Industrial & AI Computing
High-performance computing (HPC) systems
AI servers and quantum computing processors
Embedded computing and robotics
SCSPCBA’s Ultra-High-Layer Circuit Board Manufacturing Capabilities
| Ultra-High-Layer PCB Item | Ultra-High-Layer PCB Capability | ||
|---|---|---|---|
| Number of Layers | 16 – 50+ layers | Surface Finishes | ENIG, Immersion Silver, Immersion Tin, OSP, HASL, Lead-free HASL |
| Max Board Size | 610mm × 1200mm (custom sizes available) | Solder Mask Colors | Green, Blue, Black, White, Red, Yellow |
| Min Board Thickness | 1.0mm | Impedance Control | Yes, with advanced simulation and strict tolerance (±5%) |
| Max Board Thickness | 12.0mm | Thermal Management | Thermal vias, heat sinks, metal core options available |
| Base Materials | FR4 (High-Tg), Rogers, PTFE, Polyimide, Ceramic | Warping Tolerance | ≤0.5% |
| Copper Thickness | 0.5oz (18µm) to 6oz (210µm) | Hole Copper Thickness | ≥25µm |
| Min Line Width/Spacing | 0.075mm/0.075mm (3mil/3mil) | Testing Methods | Flying probe, X-ray inspection, AOI, impedance test, high-voltage test, thermal cycling |
| Min Drilled Hole Diameter | 0.2mm (8mil) for mechanical drilling, 0.075mm (3mil) for laser drilling | Size Tolerance | ≤±50μm |
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